IEEE CPMT Thermal and Mechanical Technical Committee
(CPMT TC-THERMAL AND MECHANICAL)

Welcome to the CPMT Technical Committee on Thermal Managment and Thermomechanical Design website

The Thermal Management and Thermomechanical Design Technical Committee is concerned with all aspects of thermal, thermo-mechanical, electro-thermal phenomena related to electronic/microelectronics packaging and electrical systems. The subjects of interest include:

• Electronic Cooling and Thermal Management of Component and System
• Thermal Design and Analysis
• Coupled Electro-Thermal Phenomena
• Thermal and Thermomechanical Measurements
• Thermal Mismatches and Stressses
• Temperature Induced Fracture and Moisture Stresses in IC Package
• Thermomechanical Design and Analysis of Component and System
• Thermomechanical Computer Aided Design and Engineering

Associated Activites:

• SEMI-THERM 33 (March 13-17, 2016; San Jose, CA) – Semiconductor Thermal Measurement, Modeling and Management Symposium
• ECTC 2015 (May 26-29, 2015; San Diego, CA) – Electronic Components and Technology Conference
• ITherm 2016 (May 31-June 3, 2016; Las Vegas, NV) – Intersociety Conference on Thermal and Thermomechanical Phenomena in Electrical Systems
• EPTC 2015 (December 2-4, 2015; Singapore) – Electronics Packaging Technology Conference

For suggestions or comments on TC-9 Web Page, please contact TC-9 Webmaster. To join IEEE/CMPT TC-9, contact TC-9 Chair, Vice Chair, or Webmaster.

• Prof. Dereje Agonafer, TC Chair, Dept. of Mechanical and Aerospace Engineering, University of Texas at Arlington, Arlington, TX 76019, (Tel) +1-817-272-7377
• Prof. David B. Go, Webmaster, Department of Aerospace and Mechanical Engineering, University of Notre Dame, Fitzpatrick Hall of Engineering, Notre Dame, IN 46556. (Tel) +1 574-631-8394

Anyone can be a participating member of one or more of the CPMT Society's TCs without belonging to the IEEE; most of our TCs have a mailing list, a newsletter, and a networking listing.