Facilities

Major Equipment

Electron-Beam and Optical Lithography and Pattern Generation

Vistec EBL system, 100 kV, 8-inch laser stage, 2 nm beam
GCA Autostep 200 i-line wafer stepper
Mann 3600F photomask pattern generator
Cobilt contact mask aligner
Karl Suss MJB-3 contact mask aligners (x 2)

Materials Deposition

Leybold 5-target UHV sputtering system
Leybold 3-chamber, 16-target UHV sputtering system for magnetic materials
Leybold 8-pocket electron-beam, dual thermal evaporation system
Denton Explorer electron-beam evaporator
Three Airco FC-1800 multi-pocket electron-beam evaporators
Perkin-Elmer RF, DC magnetron, 8-inch, 3-target sputter deposition system
Cambridge Nanotech Savannah atomic layer deposition (ALD) system
Unaxis 790 plasma-enhanced chemical vapor deposition (PECVD) system
First Nano 3-tube, low-pressure chemical vapor deposition (LPCVD) system
General Air atmospheric-pressure CVD (APCVD) system
Oxford FlexAL remote plasma and thermal ALD system
Structured Materials Industries low-pressure & hot-wire CVD (LPCVD, HWCVD) system
Emitech K675X 3-target, Peltier-cooled sputtering system

General Fabrication and Etching

Alcatel 601E inductively coupled plasma reactive ion etch (ICP-RIE) system
Oerlikon Shuttleline ICP-RIE system with endpoint system
Oxford PlasmaPro System 100 ICP-RIE system with endpoint system
Six Thermco furnace tubes (oxidation diffusion)
Modular Process Technologies rapid thermal processor (RTP)
Allwin RTP
Plasmatherm 790 RIE
PVA PS210 microwave plasma asher
Tegal barrel asher
Drytek RF plasma asher
Logitech Orbis chemical-mechanical polishing system (CMP), Type 1CM62
MemsStar BT001 xenon difluoride (XeF2) etch system
Allied Multiprep CMP system

Imaging

Hitachi S4500 field emission SEM with 4-Pi energy dispersive spectroscopy (EDS)
Olympus Sterozoom microscopes
Olympus MX51 IR optical microscopes

Metrology

KLA/Tencor P-6 profilometer
Gaertner Scientific automated ellipsometer
J. A. Woollam variable-angle spectroscopic ellipsometer (VASE)
Metricon prism coupler
Filmetrics film thickness measurement system (spectral reflectance)
Tencor Alphastep model 500 surface profilometer
Veeco FPP-5000 automatic four-point probe
Agilent B1500 semiconductor parameter analyzer with I-V and capacitance-voltage modules

Assembly and Packaging

Micro automation dicing saw
Hybond wedge bonder
Westbond die attach, ribbon bonder, and ball bonder
Disco DAG810 automatic surface grinder

Notre Dame Integrated Imaging Facility (NDIIF)

Magellan 400 field-emission scanning electron microscope
Helios NanoLab DualBeam 600 SEM/FIB
Titan 80-300 300kV FEG scanning transmission electron microscope (TEM)
3D laser confocal optical microscopy
In vivo imaging, including Albira PET/SPECT/CT and Multispectral FX

 

 

10.31.14