Combinatorial Sputtering:
The sputtering system includes five fixed 2" sputtering sources, with computer controlled shutters. The sputtering guns operate under either DC or RF power and can deposit material from either metallic or insulating targets. The system is designed to process 2" diameter wafers. Rotation of the mask carousel and substrate holder under computer control allows the substrate to be positioned above any of the guns with any mask positioned between. A program sequentially selects gun/mask combinations to deposit a series of multilayer samples with varying compositions on the substrate.
Discrete composition libraries are formed by depositing through a set of twelve laser etched stainless steel quaternary shadow masks. There are four basic mask designs, with each mask being used in three different orientations (rotated 90° from each other).
An example of a mask set for use with a multichannel microelectrode array (MMA) testing system is shown. Here each library member sits on an electrode that is biased individually. The measurements on the member pads are performed in parallel. A set of TiN "capture pads" and conductive traces is first deposited through a pattern defined in either a contact mask or an exposed resist layer.
The combinatorial library design masks have 64 variable composition pads along with 12 fixed composition reference pads (indicated in red on the periphery. The use of reference pads permits easy comparison between libraries. The blue pads in the three mask designs indicate the openings in the quartile masks through which deposition would occur in a sequential fashion. A total of 12 such masks (again employing 90° rotations) are employed to build a library.
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