Advanced Packaging and Interconnects

Research focuses on interconnects and packaging to support high-frequency and heterogeneous integrated systems. Approaches being investigated include:

Quilt Packaging, a novel approach for interconnecting multiple integrated circuits using metal nodules at the edge of each die. Integration of cavity-backed antenna structures into packaging for directly providing efficient wireless capabilities to systems without additional components

Devices and systems are designed and characterized in the High Speed Circuits and Devices lab, and are fabricated using the capabilities of the Notre Dame Nanofabrication Facility.

Recent highlights (selected):

• Demonstration of integrated cavity-backed antenna into packaging at Ka band (Z. Sun et al., IEEE Antennas and Wireless Propagation Lett., vol. 5, 2007)
• Ultra low-loss, high speed interconnects between chips demonstrated using quilt packaging (G.H. Bernstein et al., IEEE Trans. Advanced Packaging, 2007)
• Fabrication of quilt-packaging interconnect structures (Q. Liu et al., J. Microelectronics and Electronic Packaging, 2007)