- William J. McCalla Best Paper Award at IEEE/ACM International Conference on Computer-Aided Design (2 out of 750 submissions), 2023
- Second Place Winner, Tiny and Fair ML Design Contest at IEEE/ACM ESWEEK, 2023
- ACM/IEEE DAC Under-40 innovators Award, 2023
- Best Demonstration (First Place), University Demo, IEEE/ACM Design Automation Conference, 2021
- ACM Distinguished Speaker, 2021-2024
- IEEE CEDA Distinguished Lecturer, 2022-2023
- IEEE Transactions on Computer Aided Design Donald O Pederson Best Paper Award, 2021
- Top Winning Award, IEEE SERVICES Hackathon, 2020
- MICCAI Society Young Scientist Award Nomination, 2020
- Best Paper Nomination at IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2020
- IEEE Computer Society TCVLSI Mid-Career Award 2019
- Best Paper Nomination at IEEE/ACM International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS) (3 out of 74 submisisons), 2019
- Best Student Paper Award at IEEE Conference on Computer Vision and Pattern Recognition Workshop 2019
- Best Paper Nomination at IEEE/ACM Design Automation Conference 2019 (5 out of 815 submissions)
- Air Force Summer Faculty Fellowship, 2015, 2016
- Best Paper Nomination at IEEE/ACM Design Automation Conference 2016 (16 out of 674 submissions)
- ACM SIGDA Outstanding Service Award, 2015
- NSF/IEEE-TCPP Early Adopter Status Award, 2015, 2014, 2012
- Best Paper Nomination at ACM International Symposium on Physical Design 2015
- IEEE Region 5 Outstanding Individual Achievement Award, 2015
- Missouri S&T Teaching Excellence Award, 2015
- Innovation Award, the Academy of Science, St. Louis, 2014.
- Humboldt Research Fellowship for Experienced Researchers, 2014
- Carl Friedrich von Siemens Fellowship, 2014
- Missouri S&T Faculty Excellence Award, 2014
- IEEE St. Louis Section Outstanding Educator Award, 2014
- Gold Medal, Taipei International Invention Show and Technomart, 2014
- Best Paper in Track at IEEE/ACM International Conference on Computer Aided Design 2014
- National Science Foundation CAREER Award, 2014
- JSPS (Japan Society for the Promotion of Science) Invitation Fellow, 2014 University Teaching Commendation Award, 2012, 2013
- Best Paper Nomination at ACM International Symposium on Physical Design 2013 (4 out of 55 submissions)
- University of Missouri Faculty Scholar, 2012
- Third place winner at ISPD Discrete Gate Sizing Contest, 2012
- Second place winner at TAU Workshop Power Grid Analysis Contest (sponsored by IBM) 2011
- IEEE/ACM Design Automation Conference Alumni Scholarship 2010
- Best Paper Nomination at IEEE/ACM Design Automation Conference 2009 (7 out of 682 submissions)
- IBM Invention Achievement Award for First Patent Application 2009
- Best Paper Nomination at IEEE/ACM Asia and South Pacific Design Automation Conference 2009 (12 out of 350 submissions)
- Best Paper Nomination at IEEE International Conference on Computer Design 2008
- William J. McCalla Best Paper Nomination at IEEE/ACM International Conference on Computer Aided Design 2007 (9 out of 510 submissions)
- Best Paper Nomination at IEEE/ACM Design Automation Conference 2006 (10 out of 1007 submissions)
- Outstanding M.S. Award, UCLA Henry Samueli School of Engineering and Applied Science, 2007
- UCLA University Fellowship 2005 - 2006
- Rank 1/164 for overall undergraduate GPA in the Electronic Engineering Dept., Tsinghua University, 2005
- Outstanding B.S. in Beijing (top 0.5%) 2005
- Outstanding B.S. in Tsinghua University (top 2%) 2005
- Outstanding Bachelor Thesis in Tsinghua University (top 5%) 2005
- Meritorious (First Prize) for the International Mathematical Contest in Modeling (MCM) 2005
- Jiang Nanxiang Outstanding Performance Scholarship (top 0.2%) 2004
- First Prize at the Chinese Undergraduate Mathematical Contest in Modeling (CUMCM) 2004
- First Prize in Beijing at the Chinese Undergraduate Mathematical Contest in Modeling (CUMCM) 2003
- Sumsung Outstanding Performance Scholarship 2003
- Third Prize of Outstanding Academic Performance Scholarship 2003