Facilities

Etch Equipment

Description

The Alcatel 601 E is an automatic etching machine used exclusively for the plasma etching of silicon and related materials. It can work with wafers of between 100mm and 200mm in diameter, at room temperature (between -30 C and +30 C) or low temperature (<100 C). The Alcatel 601 E is a manually loaded single plate type machine and is particularly well suited to R/D activities.

This machine consists of 5 parts: a process module ensuring the vacuum process of wafers, a transfer module allowing to load and unload wafers automatically while maintaining the process module under vacuum, a control module ensuring the user interface and the management of the machine, a gas module ensuring the supply of the machine with process gas and a utilities module allowing the utilities connections (water, air, dry nitrogen, helium, liquid nitrogen bottle or chiller, external rough pumps) as well as electrical connections. The system is currently equipped with SF6, C4F8O2, and CF4 process gases.

Allowed Materials

Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO2 (glass), and cleaned Al2O3 (sapphire).

Prohibited Materials

Indium, tin, zinc, iron, and organics.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

04.01.15

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