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Facilities

Etch Equipment

Description

The TeGal PlasmaLine asher is a general purpose O₂ plasma used to remove photoresist and for general purpose cleaning. It incorporates RF as the plasma source and is typically used at 300-400 mT. It has a high selectivity to resist and an overall low removal rate. It is typically used for descrum processes.

Allowed Materials

Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO₂ (glass), and cleaned Al₂O₃ (sapphire).

Prohibited Materials

Indium, tin, zinc, iron, and organics.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

12.8.15

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