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Deposition Equipment

Description

The Unaxis 790 Series Plasma Enhanced Chemical Vapor Deposition (PECVD) system is used for the deposition of SiO2 & Silicon Nitride on Silicon and other wafers. The 790 Series systems are designed to provide plasma scientists with a flexible and cost effective platform for parallel plate processes. The PECVD system is computer based for wafer processing and control of all gasses, timing, and RF power applications. The top electrode is RF powered and the substrate is temperature controlled by means of an embedded resistance heater.

Film types available on the PECVD are: Si₃N₄ & SiO₂.

Gases: SiH₄, SF₆, N₂, N₂O, and NH₃.

Contact Information:

For additional information, please contact the NDNF staff at pfay@nd.edu.

2.10.15

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