Facilities

Etch Equipment

Description

Model 144AX produces near-atomically clean surfaces in less than one minute by utilizing the UV/Ozone cleaning method. This process effectively and thoroughly removes an assortment of organic contaminants from surfaces. These contaminants include human skin oils, silicone oils, solder flux, residues from wet cleaning processes or water residue, contamination absorbed during prolonged exposure to air, and many others.

Allowed Materials

Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO2 (glass), and cleaned Al2O3 (sapphire).

Prohibited Materials

Indium, tin, zinc, iron, and organics.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

04.01.15

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