Facilities
Deposition Equipment
- Oxford FlexAL Atomic Layer Deposition (ALD) System
- Manufacturer:
Oxford Instruments - Operating Instructions · User's Manual
- Current conditions:
- Al2O3 TMA 300C Plasma
- HfO2 TDMAH Plasma
- SiO2 BDEAS 300C
- ZrO2 TDMAZ Plasma
Description
The Oxford Instruments FlexAL atomic layer deposition system is a plasma-enhanced ALD system for the monolayer growth of thin films. Self-limiting layer-by-layer growth ensures precise control, film conformity, and film repeatability. The system is currently installed with heated precursors for the deposition of titanium, aluminum, silicon oxides/nitrides, and platinum metals. NH3 H2, O2, and N2 are available for plasma-assisted oxides and nitrides. Remote ICP plasma powers up to 400W are possible. The system is load-locked and can accommodate sample temperatures up to 300°C.
Film types available: SiO2, Si3N4, Pt, Al2O3, TiO2, and Ta2O5
Gases: H2, NH3, O2, Ar, N2 , and SF6
Contact Information:
For additional information, please contact the NDNF staff at pfay@nd.edu.
