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Facilities

General Fabrication Equipment

Description

The MultiPrep^TM System enables precise semi-automatic preparation of a wide range of materials for microscopic (optical, SEM, EBSD, FIB, TEM, AFM, etc.) evaluation and package thinning applications. System features include adjustable platen speeds and directions, head rotation and direction and head oscillation. Precise control of polishing is achieved through use of dual micrometers that allow for parallel polishing to less than 75 microns. Samples are mounted to the polishing head with wax to allow for easy mounting and removal. Control over surface finish is achieved through reduction in polishing pad media (typically 30 to 0.05 micron) and colloidal suspensions.

Allowed Materials

GaAs and its compounds ONLY.

Prohibited Materials

This system is currently only used for GaAs thinning.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

12.8.15

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