Facilities

Major Equipment

 

Materials Deposition

Airco Temescal FC-1800 multi-pocket electron-beam evaporators (3)
Denton Explorer electron-beam evaporator
Emitech K675X 3-target, Peltier-cooled sputtering system
First Nano 3-tube, low-pressure chemical vapor deposition (LPCVD) system
General Air atmospheric-pressure CVD (APCVD) system
Oerlikon Leybold 5-target UHV sputtering system
Oerlikon Leybold 3-chamber, 16-target UHV sputtering system for magnetic materials
Oerlikon Leybold 8-pocket electron-beam, dual thermal evaporation system
Oxford FlexAL remote plasma and thermal ALD system
Perkin-Elmer RF, DC magnetron, 8-inch, 3-target sputter deposition system
Cambridge Nanotech Savannah atomic layer deposition (ALD) system
Unaxis 790 plasma-enhanced chemical vapor deposition (PECVD) system
Varian thermal deposition system
Veeco evaporator

Etching

Alcatel 601E inductively coupled plasma reactive ion etch (ICP-RIE) system
Drytek RF plasma asher
MemsStar BT001 xenon difluoride (XeF2) etch system
Oerlikon Shuttleline ICP-RIE system with endpoint system
Oxford PlasmaPro System 100 ICP-RIE system with endpoint system
Plasmatherm 790 RIE
PVA PS210 microwave plasma asher
Tegal barrel asher
UVO cleaner

General Fabrication

Allied Multiprep CMP system
Allwin AccuThermo AW610 Rapid Thermal Processing (RTP) System
Logitech Orbis chemical-mechanical polishing system (CMP), Type 1CM62
Six Thermco furnace tubes (oxidation diffusion)
SSI Solaris 75/100 Rapid Thermal Processor

Lithography

Cobilt CA-800 wafer-to-mask alignment and exposure system
RTS AutoStep 200
RTS Mann 3600F pattern generator
Lindberg/BlueM resist baking oven
OAI light source
SUSS MJB 3 mask aligner (2)
Tamarack Series 142 contact printer
Vistec EBPG 5200 electron beam lithography system

Metrology

Agilent B1500 semiconductor parameter analyzer with I-V and capacitance-voltage modules
Tencor Alphastep model 500 surface profilometer
Cascade Microtech M150 test station
Filmetrics film thickness measurement system (spectral reflectance)
Four-point resistivity probe
Veeco FPP-5000 automatic four-point probe
Gaertner ellipsometer
Hitachi S-4500 field emission scanning electron microscope
KLA/Tencor P-6 profilometer
Olympus LEXT OLS4100 confocal microscope
Olympus optical microscopes (4)
J. A. Woollam variable-angle spectroscopic ellipsometer (VASE)

Packaging

Disco DAG810 automatic surface grinder
Disco DAD3240 automatic dicing saw
Teledyne TAC probe
WEST-BOND 7372W die bonder
WEST-BOND 7400A wire bonder
WEST-BOND 7476E wire bonder

Other Equipment
Ampoule sealing station
Blue M furnace
Critical point dryer
III-V area
MOS-clean bench
MOS-clean spin rinse dryer
Spin rinse dryer
Molecular beam epitaxy

Notre Dame Integrated Imaging Facility (NDIIF)

Magellan 400 field-emission scanning electron microscope
Helios NanoLab DualBeam 600 SEM/FIB
Titan 80-300 300kV FEG scanning transmission electron microscope (TEM)
3D laser confocal optical microscopy
In vivo imaging, including Albira PET/SPECT/CT and Multispectral FX