Packaging Equipment


The Disco Automatic Dicing Saw (Model DAD 3240) is a programmable automatic saw for cutting semiconductor wafers and other hard materials. Operation of the dicing saw is through a touchscreen LCD, through which the user supplies a recipe for cutting, performs manual alignments, and processes the wafer in an automatic or semi-automatic cutting sequence. Work-piece loading and unloading is done manually at the front of the machine. The DAD 3240 can handle small pieces as well as 4”, 6”, or 8” inch wafers that are mounted on dicing tape.

Allowed Materials

Group IV semiconductors (Si, Ge, and C materials and alloys), GaAs and related materials, InP and related materials, GaN and related materials, silica glasses, and Al2O3 compounds (alumina and sapphire). Other materials with consent of lab staff.

Prohibited Materials


Cleaning procedure

Samples should be free of greases, oils, fingerprints, and particles. If necessary, samples should be cleaned in solvents, followed by DI rinse and N2 blow dry. Particular attention should be paid to the back side of the sample (which will be adhered to the dicing tape).  If particles from cutting are a potential problem, a coating (i.e. photoresist or similar) may be applied prior to cutting.

Contact Information:

For additional information, please contact the NDNF Staff at mthomas@nd.edu.

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