Facilities

Metrology Equipment

Description

The P-6 offers complete high-resolution 2D and 3D analysis of surface topography in a versatile platform. The system is capable of scanning up to 150 mm wafers. The process recipes allow users to select one of three vertical ranges that best match the profile to be measured. The system is equipped with a 2 um radii tip for measurement applications. The P-6 is routinely calibrated onsite with 4700, 900, and 160 angstrom VLSI reference standard to ensure system performance. The system has adjustable scan speeds and stylus force settings, which allow for flexibility with any surface to be measured.

Allowed Materials

Semiconductor-based materials, dielectrics, metal films, and resists.

Prohibited Materials

Magnetic materials, organics, epoxy, rubbers and plastics, and liquids of any kind.

Cleaning procedure

Samplesgenerally do not require special cleaning, unless needed to remove prohibited materials before processing. All materials to enter the equipment will be handled with wafer tongs by an operator wearing latex, poly, or nitrile clean gloves..

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

06.30.15

Back to Equipment List