General Fabrication Equipment


The Logitech Orbis system is used for fine-scale polishing and planarization of a variety of metals in the damascene process. Small samples and full wafers up to 6" diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. CMP applications often require customized process parameters (spin speed, force, and slurry) to achieve the desired result in most applications.

Allowed Materials

Semiconductor based materials, dielectrics, and metal films.

Prohibited Materials

Magnetic materials, organics, resists, tapes, epoxy, rubbers and plastics; organic materials; liquids of any kind.

Cleaning procedure

Samples generally do not require special cleaning, unless needed to remove prohibited materials before processing. All materials to enter the equipment will be handled with wafer tongs by an operator wearing latex, poly, or nitrile clean gloves.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

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