Deposition Equipment


The Oxford Instruments FlexAL atomic layer deposition system is a plasma-enhanced ALD system for the monolayer growth of thin films. Self-limiting layer-by-layer growth ensures precise control, film conformity, and film repeatability. The system is currently installed with heated precursors for the deposition of titanium, aluminum, silicon oxides/nitrides, and platinum metals. NH3 H2, O2, and N2 are available for plasma-assisted oxides and nitrides. Remote ICP plasma powers up to 400W are possible. The system is load-locked and can accommodate sample temperatures up to 300°C.

Film types available: SiO2, Si3N4, Pt, Al2O3, TiO2, and Ta2O5

Gases: H2, NH3, O2, Ar, N2 , and SF6

Contact Information:

For additional information, please contact the NDNF staff at pfay@nd.edu.

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