Facilities
Other Equipment
- Spin Rinse Dryer
- Manufacturer:
Sitek Process Solutions
Description
The Sitek spin rinse dryer is a compact tabletop dryer that is capable of processing 4" wafers. It has variable timers and speed controls for the rinse (max 1000 rpm) and drying (max 4000 rpm) process.
Allowed Materials
Semiconductor based materials, dielectrics, metal films.
Prohibited Materials
Magnetic materials, organics, resists, tapes, epoxy, rubbers and plastics, organic materials, liquids of any kind.
Cleaning procedure
Samples generally do not require special cleaning, unless needed to remove prohibited materials before processing. All materials to enter the equipment will be handles with wafer tongs by an operator wearing latex, poly, or nitrile clean gloves.
Contact Information:
For additional information, please contact the NDNF Staff at pfay@nd.edu.
11.13.15
