Facilities

General Fabrication Equipment

Description

The six-stack Thermco Furnace is used for general purpose silicon processing. Each furnace can process up to 1100°C and can accommodate 4" wafers. Each of the furnace tubes is dedicated for a sole purpose:

Tube 1 - Device-quality gate oxides (N2, O2, and TransLC)
Tube 2 - Dry & wet oxidation (N2 and Torch (O2 and H2) available)
Tube 3 - Metal annealing (O2 and N2)
Tubes 4 & 5 - Implant activation and general purpose oxidation (O2 and N2)
Tube 6 - Equipped with vacuum capabilities (O2 and N2)

Allowed Materials

Silicon wafers.

Prohibited Materials

Anything else.

Cleaning procedure

See operating instructions above.

Contact Information:

For additional information, please contact the NDNF Staff at pfay@nd.edu.

06.26.15

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