Facilities

Lithography Equipment

Description

The Vistec EBPG5200 is a high-end, state-of-the-art electron beam lithography system that can write to less than 8 nm in size on full 200 nm wafers or small sample pieces. The system uses a high current density thermal field emission gun for operation at 20, 50, and 100kV accelerating voltages. Rapid exposure is possible with up to 50 MHz write speeds and a 20-bit pattern generator. The system incorporates breakthroughs in enhanced resolution, noise reduction, and beam stability for the ultimate in nano-lithography.

Allowed Materials

Semiconductor-based materials, dielectrics, metal films, and resists.

Prohibited Materials

Magnetic materials, organics, epoxy, rubbers, and plastics. Substances that can outgas/sublime/evaporate in vacuum; hydrocarbons (oil, grease, fingerprints); organic materials; liquids of any kind.

Cleaning Procedure

Samples generally do not require special cleaning, unless needed to remove prohibited materials before processing. All materials to enter the equipment will be handled with wafer tongs by an operator wearing latex, poly, or nitrile clean gloves.

For additional information, please contact the NDNF staff at pfay@nd.edu.

6.26.15

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