Facilities
Packaging Equipment
- WEST-BOND 7400A Wire Bonder
- Manufacturer:
WEST·BOND Inc.
Description
The Model 7400A is an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads toe semiconductor, hybrid or microwave devices. The machine bonds aluminum or gold wire ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations.
Allowed Materials
Si, Ge, C, GaAs, and InP.
Prohibited Materials
None.
Cleaning procedure
Samples should be free of greases, oils, fingerprints, and particles. If necessary, samples should be cleaned in solvents, followed by DI rinse and N2 blow dry. Particular attention should be paid to the back side of the sample.
Contact Information:
For additional information, please contact the NDNF Staff at pfay@nd.edu.
