Facilities
Packaging Equipment
- WEST-BOND 7476E Wire Bonder
- Manufacturer:
WEST·BOND Inc.
Description
The base model of this series is Model 7400E, an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations. The 7476E now has a new and unique WEST-BOND three-axis micromanipulator in which the entire mechanism is arrayed above the work plane, so that there is now no limit to the size of a workpiece.
Contact Information:
For additional information, please contact the NDNF Staff at pfay@nd.edu.
